快过年了, 代找电声主管一名

1、有五年以上微型电声器件研发经验，三年以上研发管理经验。

2、大型企业工作过为佳，如NXP AAC SONION

3、英文需要熟练

感兴趣者请直接跟本人联系！

 申请号码: ENG476 工作职位名称: Principal Engineer, MEMS 报告管理: Welsh, Christopher
招聘官员: Tankersley, Wendell
兴趣领域: Engineering/ Technology
职业等级: Experienced (non-manager)
职位类型: Full Time - Regular
市: Indianapolis
州/省: Indiana
国家: United States
工作类型: Exempt
职位描述:  

Essential Responsibilities:

 

The Harman Embedded Audio Group (formerly MWM Acoustics, LLC) is seeking a Principal MEMS Engineer to lead the development of advanced packaging solutions for our MEMS microphone products.  This position will focus on developing and implementing cutting-edge packaging designs that result in products with best-in-class reliability, robustness, size and cost.  This position will collaborate closely with microphone, MEMS die, and ASIC design engineers, as well as the foundry and factory production staff.  

The MEMS Packaging Engineer will work closely with the foundry and packaging partner to leverage preferred processes to deliver cost effective, high performance, and robust design solutions.

This position reports to the Engineering Manager and is located at the group head quarters in Indianapolis, Indiana.

Specific responsibilities of the position are as follows:

• Lead the design and development of new MEMS packaging technology and products.
• Work closely with the foundry and packaging factory engineers to understand and utilize key processes in MEMS microphone designs.
• Determine the feasibility of new technology, ideas, and products proposed or ideated.
• Optimize prototype and/or design parameters to maximize
• Plan experiments to prove in, or troubleshoot, new or existing products.
• Play a significant role in the validation plans for new and existing products.
• Contribute to intellectual property and evaluate IP strategy

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Basic Qualifications:

1.     REQUIRED Specific Knowledge, Expertise, Coursework

 

2.     REQUIRED Degree and/or Training, including specifically defined educational equivalent

B.S.  Degree in Acoustics, Mechanics, or Engineering

 

3.     REQUIRED Specific Prior Experiences

• At least 2 years relevant work experience in MEMS design, fabrication, packaging and testing
• Thorough understanding of MEMS device packaging techniques such and die and wire bonding, encapsulation, singulation and testing.
• Thorough understanding of CMOS and Flip Chip processing techniques.
• Experience using optical systems for analysis.
• Experience with EMI and Environmental testing of MEMS devices.
• Design and Development for Manufacturability (DFM) experience with semiconductor or MEMS devices.

4.     REQUIRED Physical Demands

Physical Demands -The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job.  Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions. While performing the duties of this job, the employee is regularly required to sit; use hands to finger, handle, or feel; and talk or hear. 

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Desired Characteristics:

1.     PREFERRED Knowledge, Expertise, Coursework

The preferred candidate will hold a M.S. or Ph.D. in Acoustics, Mechanics, Engineering, or other technical field.

2.     PREFERRED Specific Prior Experiences

• The preferred candidate will have at least 6 years experience per the description above.
• They will have experience in designing capacitive MEMS devices like microphones or pressure sensors.
• They will have significant experience in the design, handling and launching new MEMS products

3.     REQUIRED Work Traits/Competencies

• Must work well in a global, cross functional development team.
• Must be able to independently drive projects.
• The preferred candidate will be an excellent communicator with the ability to conceive and present new ideas effectively.

4.     REQUIRED Skills and Abilities

• Ability to successfully manage multiple projects concurrently

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Eligibility Requirements:

• Willingness to travel up to 20% of the time, including some international travel.
• Willingness to work in an office in Indianapolis, IN.
• Willingness to submit to a background screen and a drug test 

不过反过来，对于从事这方面的工程师会是好事，毕竟以后可以选择的范围更加广了，而不是局限于现在的个别企业。