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SPICE Simulation of Headphones and Earphones

Unlike loudspeakers, headphones and earphones are not in the mainstream of electroacoustical design. In this paper, different designs for headphones and earphones are discussed and simulated with the aid of SPICE, the well known electrical circuit simulator. These simulations can be used to perform elementary design tradeoffs. One significant difficulty is the lack of component measurements in the open literature. The paper begins with an overview of design aspects of headphones. This is followed by a review of the use of SPICE as an electroacoustical simulator. The following section detai ls various experiments done using SPICE to explore headphone design. The conclusion decries the lack of publicly available information as well as the dearth of components.

Author:Kahrs, Mark
Affiliation:University of Edinburgh, Edinburgh, UK
AES Convention:127 (October 2009)Paper Number:7843Import into BibTeX
Subject:Transducer Modeling and Design

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Modeling the External Ear Acoustics for Insert Headphone Usage

The acoustic behavior of earphones that are inserted into the ear canal is difficult to determine because it requires observing the sound pressure at the eardrum. Insert earphones occlude the ear canal, which cancels the normal influence of concha, pinna, head, and shoulders. In addition, the tone color of inserted earphones depends on the acoustic impedance of the eardrum and the leakage of earphone fitting. These results are relevant for designing insert earphones that are to be used in binaural and auralization situations.

Authors:Hiipakka, Marko; Tikander, Miikka; Karjalainen, Matti
Affiliations:Department of Signal Processing and Acoustics, Aalto University, Espoo, Finland; Nokia Corporation, Helsinki, Finland(See document for exact affiliation information.)
JAES Volume 58 Issue 4 pp. 269-281; April 2010Import into BibTeX

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