转发：

MEMS硅麦克风技术进展总结报道

Knowles' Micro Electro-Mechanical Systems (MEMS) technology platform brings you smaller product design possibilities and related cost advantages, including silicon-based, surface mount manufacturing.

Traditional uses of silicon involve creating pathways for electricity within components such as integrated circuits. In contrast, MEMS transforms silicon into mechanically moving parts. During the past decade, this process has become useful in an increasing number of industries. For example, the automotive market uses MEMS accelerometers to sense crashes and deploy airbags.

Our research in MEMS led to the introduction of the world's first surface mount microphone in 2001 to 2002, the SiSonic series. We have since helped major brands design breakthrough cell phone and consumer electronics products, while eliminating the cost of traditional offline ECM microphone subassemblies.

高质量音频采集 Hear the Differences

全球各地的设计工程师正越来越了解ADI公司创新性iMEMS技术的强大能力。从最初的运动传感器，到现在的iMEMS麦克风，这推动着iMEMS技术在数百项尖端应用中得以实现。

iMEMS 麦克风结合了20年的MEMS技术诀窍与ADI公司音频信号处理专业技术，能够提供无与伦比的性能与可靠性。iMEMS模拟与数字输出麦克风具有61dB 的SNR（A-weighted），以及从100Hz到大于12kHz的平坦度响应，可提供出色的音频采集性能，满足下一代音频需求。

Surface Mount MEMS Microphones

· New MaxRF models eliminate GSM/TDMA burst noise and provide wide-band RF noise suppression

· UtlraMini footprint - less than 11.5mm2 (SPU Series)

· Slim UltraMini footprint - less than 8.5mm2 (SPQ Series)

· Digital mics eliminate analog noise

· Integrated designs with differential or switchable gain

· "Zero height" for thinnest ever designs

SiSonic MEMS Microphone

Built on our CMOS/MEMS technology platform (originally launched in 2002), the SiSonic silicon-based microphone series is entering its fourth generation of development, with product shipments exceeding 800 million units to date. The proven and evolving design series continues to support high-performance, high-density innovation in such applications as cell phones, digital still cameras, portable music players, and other portable electronic devices.

Design variables include ever-smaller sizes, lower profiles and mounting options, increased output capacities, and new digital audio options that eliminate analog noise. For manufacturers, surface mount designs eliminate off-line subassembly production costs. Customized designs are supplied on tape-and-reel and can be run through standard automatic pick-n-place equipment during in-line surface mount manufacturing.

The microphones can also be integrated with our patented IntelliSonic software and special porting designs to provide a precisely customized sound.

Features

· Silicon structure for high degree of manufacturing repeatability and stable (predictable) acoustic performance

· Patented "free-floating" diaphragm is immune to shifts in microphone sensitivity caused by variable mechanical tension in traditional electret condenser microphone diaphragms

· Low mass, low size diaphragm produces excellent vibration sensitivity performance

· Excellent RFI and EMI suppression

· Excellent operating and storage temperature ratings -40C to 100C

· Versatile configuration and sound porting options for future microphone enhancements

· 45% less board space than 6x2.2 ECMs

· 30% lower profile height than ECMs

· RoHS Compliant and Halogen Free

· Highly shock resistant

· Ideally suited for high volume applications