声学楼论坛 → 技术交流区 → 电声器件与系统设计 → 软件应用及仿真室 → 分享一篇关于耳机设计的论文

共有22071人关注过本帖树形打印复制链接主题：分享一篇关于耳机设计的论文

冰冻德芙

小大 1楼 | QQ | 信息 | 搜索 | 邮箱 | 主页 | UC

加好友

发短信

声学部门的
等级：新手上路帖子：175 积分：1173 威望：0 精华：0 注册：2011-9-19 9:33:44

分享一篇关于耳机设计的论文 发帖心情

Post By：2011-9-20 9:49:53 [只看该作者]

这是我看过的比较易懂，又入门级的关于耳机设计的论文《++AES C120 - Headphone Fundamentals - 耳机入门》，分享一下。

不过附件好像有点大，上传权限不够，需要者可以联系。

烟火

小大 2楼 | 信息 | 搜索 | 邮箱 | 主页 | UC

加好友

发短信

等级：新手上路帖子：149 积分：2382 威望：0 精华：0 注册：2008-2-26 19:31:08

Post By：2011-9-20 10:04:42 [只看该作者]

老兄我的邮箱是115815085@163.com 麻烦你发一份给我吧！谢谢！

子卿

小大 3楼 | 信息 | 搜索 | 邮箱 | 主页 | UC

加好友

发短信

魅生妖颜
等级：新手上路帖子：376 积分：2315 威望：0 精华：0 注册：2011-3-1 21:33:04

Post By：2011-9-20 10:11:57 [只看该作者]

fy-py@163.com

多谢楼主MM~

谁等谁等了一万年，只是等来了一个错；谁对谁凝望一秒钟，转瞬带走了传说...

今昔

小大 4楼 | 信息 | 搜索 | 邮箱 | 主页 | UC

加好友

发短信

等级：业余侠客帖子：58 积分：392 威望：0 精华：0 注册：2010-11-1 11:24:46

Post By：2011-9-20 10:57:22 [只看该作者]

谢分享 yeahyfking@126.com

errantry

小大 5楼 | QQ | 信息 | 搜索 | 邮箱 | 主页 | UC

加好友

发短信

等级：侠之大者帖子：308 积分：2745 威望：0 精华：0 注册：2008-12-26 15:50:03

Post By：2011-9-20 11:04:57 [只看该作者]

zhaony523@163.com,谢谢楼主！

csy

小大 6楼 | 信息 | 搜索 | 邮箱 | 主页 | UC

加好友

发短信

等级：业余侠客帖子：47 积分：531 威望：0 精华：0 注册：2009-10-10 13:30:41

Post By：2011-9-20 12:53:45 [只看该作者]

楼主请给我一份吧，chengjian1974@163.com 谢谢！

水仙

小大 7楼 | QQ | 信息 | 搜索 | 邮箱 | 主页 | UC

加好友

发短信

电声从业人员
等级：超级版主帖子：6551 积分：51232 威望：10 精华：39 注册：2005-10-28 8:32:06

Post By：2011-9-20 15:12:50 [只看该作者]

AES E-Library

SPICE Simulation of Headphones and Earphones

Unlike loudspeakers, headphones and earphones are not in the mainstream of electroacoustical design. In this paper, different designs for headphones and earphones are discussed and simulated with the aid of SPICE, the well known electrical circuit simulator. These simulations can be used to perform elementary design tradeoffs. One significant difficulty is the lack of component measurements in the open literature. The paper begins with an overview of design aspects of headphones. This is followed by a review of the use of SPICE as an electroacoustical simulator. The following section detai ls various experiments done using SPICE to explore headphone design. The conclusion decries the lack of publicly available information as well as the dearth of components.

Author:Kahrs, Mark
Affiliation:University of Edinburgh, Edinburgh, UK
AES Convention:127 (October 2009)Paper Number:7843Import into BibTeX
Subject:Transducer Modeling and Design

Click to purchase paper or login as an AES member. If your company or school subscribes to the AES Journal then you can look for this paper in the institutional version of the Online Journal. If you are not an AES member and would like to subscribe to the E-Library then Join the AES!

This paper costs $20 for non-members, $5 for AES members and is free for E-Library subscribers.

声学楼--声学工程师之家
QQ：350824984，邮件：adrian_chi@163.com，微博：adrian_chi，微信：adrian_chi

水仙

小大 8楼 | QQ | 信息 | 搜索 | 邮箱 | 主页 | UC

加好友

发短信

电声从业人员
等级：超级版主帖子：6551 积分：51232 威望：10 精华：39 注册：2005-10-28 8:32:06

Post By：2011-9-20 15:13:17 [只看该作者]

AES E-Library

Modeling the External Ear Acoustics for Insert Headphone Usage

The acoustic behavior of earphones that are inserted into the ear canal is difficult to determine because it requires observing the sound pressure at the eardrum. Insert earphones occlude the ear canal, which cancels the normal influence of concha, pinna, head, and shoulders. In addition, the tone color of inserted earphones depends on the acoustic impedance of the eardrum and the leakage of earphone fitting. These results are relevant for designing insert earphones that are to be used in binaural and auralization situations.

Authors:Hiipakka, Marko; Tikander, Miikka; Karjalainen, Matti
Affiliations:Department of Signal Processing and Acoustics, Aalto University, Espoo, Finland; Nokia Corporation, Helsinki, Finland(See document for exact affiliation information.)
JAES Volume 58 Issue 4 pp. 269-281; April 2010Import into BibTeX